Demonstrating 3D integration on a massive scale

<p><img src='http://unitedyam.com/wp-content/uploads/2024/04/demonstrating-3d-integration-on-a-massive-scale.png' width='84' height='63' alt='Researchers demonstrated 3D integration -- vertically stacking multiple layers of semiconductor devices -- on a massive scale' border='0' align='left' /></p><p>In this rendering, researchers at Penn State demonstrated 3D integration -- vertically stacking multiple layers of semiconductor devices to pack more silicon-based transistors onto a computer chip -- on a massive scale, enabling more energy-efficient computing. [Research supported by U.S. ...</p><p>This is an NSF Multimedia Gallery item.</p>